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Processing technologies Laser
Equipment possessed by our company

The following is a description of the equipment possessed by our company and case examples of their usage.

Scanner welding system /Semiconductor laser /Excimer laser YAG laser /Q-switch YAG laser /YVO4 laser TEA-CO2 laser /CO2 laser
[Scanner welding system /Semiconductor laser /Excimer laser]

Semiconductor laser

LDL-160-3000 (manufacturer: Laserline)
• Average power output : 3kW
• Beam mode: able to inject rectangular fiber( φ1.5mm)
• Wave length: 808-940
• Purpose: welding, surface reformulation, resin adhesion
• Characteristics: pyrometer connectable, spot size variable, possesses optics system

FD-100 (Manufacturer:FINE DEVICE)
• Average power output : 30W
• Beam mode: φ0.3mm
• Wave length: 840
• Purpose: resin adhesion
• Characteristics: curing agent unnecessary, noncontact adhesion, resin recyclable

LDF-1000-4000VG5 laser blazing system

[Characteristics of the laser]
• 4kW with fiber core of φ1.0 mm
• Good absorption for blazing wire
[Characteristics of processing head]
• Welded part tracking mechanism at the tip using a servo motor
• Usage of the wire tip contacting the welded part as a position sensor
• Movable flexibly from side to side and up and down against the meandering parts of welded part
• Ability to follow the speed of robots and ensures secure blazing even at high-speed.

Excimer laser

LUMONICS INDEX848
(Manufacturer: Sumitomo Heavy Industries, Advanced Machinery)
• Pulse energy : 400mJ
• Max Pulse repetition : 200Hz
• Average power output : 80W
• Pulse Width: 18nsec
• Units possessed: 5

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