Whether laser processing is possible or not depends largely on the laser absorption properties of the material.
We will now explain the working characteristics of various types of laser in general material.
Our company can make suggestions on laser equipment that meets the requirements of our clients, including changes in materials, based on our vast experience and extensive know-how in processing for clients in various types of industry. Please feel free to contact us.

Resin Ceramic Metal Silicon Glass Teflon Acryl Rubber

Resin	CO2 laser	High workability but affected by heat. Carbonized in some cases.
	TEA-CO2 laser	High workability but shapes may change notably according to thermotolerance (PI, PPS, PEEK materials, PET materials, epoxy, etc.).
	YAG laser	Low workability because it easily penetrates due to wave length.
	Q-switch YAG laser	Low workability because it easily penetrates due to wave length.
	Excimer Laser	High workability and shapes can be maintained well (PI, PPS, PEEK materials, PET materials, epoxy, etc.)
	Semiconductor	High workability (noncontact, no die required, limited production of diversified products available).

Ceramic	CO2 laser	Suitable for processing alumina ceramic. However, it is difficult to process zirconia.
	TEA-CO2 laser	Generates burr at edges. When processing grooves, the bottom slightly melts.
	YAG laser	Possible to process various types of ceramic materials. Also possible to work with less heat effect, so it is possible to process with less cracks.
	Q-switch YAG laser	Difficult to work with white ceramic because it penetrates due to wave length. However, it is highly workable with ceramic with nearly-black colors.
	Excimer Laser	May generate burr at the edge according to the depth of processing (alumina ceramic, zirconia ceramic, etc.)

Metal	CO2 laser	Possible to process metals other than gold. However, process cannot be done in some cases.
	YAG laser	Possible to process metals other than gold. However, process cannot be done in some cases.
	Q-switch YAG laser	Possible to process metals other than gold. May generate burr on the surface when dug deep.
	Excimer Laser	Generates burr at the edge.
	Semiconductor	Perfect for surface reformulation.

Silicon	CO2 laser	Workable but not as good as other lasers.
	YAG laser	Workable but not as good as other lasers.
	Q-switch YAG laser	Workable. Better than CO2 laser but messy compared to excimer laser.
	Excimer Laser	Generates burr at the edge.
	Semiconductor	Heat treatment possible but not as good as other lasers.

Glass	CO2 laser	Workable with silica glass but difficult with other types of glass because it generates cracks.
	TEA-CO2 laser	May cause fractures at the laser injection/output side (silica glass,blue plate glass, sapphire glass, Pyrex, etc.)
	YAG laser	Unworkable because it basically penetrates.
	Q-switch YAG laser	Unworkable because it basically penetrates.
	Excimer Laser	May cause fractures at the laser injection/output side (blue plate glass, sapphire glass, Pyrex, etc.)

Teflon

TEA-CO2 laser

High workability and maintains good shape.

Acryl	CO2 laser	Possible to cut off
	TEA-CO2 laser	High workability and maintains good shape.

Rubber

TEA-CO2 laser

High workability but shapes may change notably according to thermotolerance (silicon rubber, etc.).