| 1977 |
| June |
Tosei Electrobeam Company Limited founded.
Shoji Okabe assumes post of CEO.
Electron beam welding machine introduced. Entrusted processing started. |
| 1978 |
| January |
He leak tester introduced. Nondestructive tests started. |
| 1979 |
| June |
Tamotsu Ueno assumes post of CEO. |
| 1982 |
| June |
Acquires land for headquarters. |
| 1983 |
| March |
3kW CO2 laser processing machine. Entrusted processing for CO2 laser started. |
| 1986 |
| February |
400W YAG laser processing machine introduced. Entrusted processing for YAG laser started. |
| 1989 |
| January |
"New Processing Technologies Using Laser" presented at Surface Finishing Society of Japan. |
| 1991 |
| March |
50W industrial excimer laser processing machine introduced. Entrusted processing for excimer laser started. |
| June |
"Research on Surface Reforming Technologies Using Laser" granted subsidy from MITI. |
| 1992 |
| August |
"Improving the Efficiency and Precision of Ablation Processing Using Excimer Lasers" granted subsidy. |
| 1993 |
| August |
Establishment of Network for the Data Communication of Designing Information with Clients and Participating Companies" granted subsidy. |
| 1997 |
| June |
CO2 scriber introduced. Entrusted processing for ceramic started. |
| 1998 |
| March |
Land for Hamura plant acquired. |
| April |
"Development of Measurement Technologies to Support Energy-Savings in the Production Process of Electronic Devices," research sponsored by Manufacturing Science and Technology Center
"Research on Process to Improve Life and Quality of Thermoelectric Elements and Modules through Passivation," research sponsored by National Research Institute for Metals. |
| 1999 |
| April |
"Research and Development on Technologies to Formulate Microscopic Through-Hole on Silicon-Base Ultraprecise and Microscopic Multi-Layer Mounting Board," research sponsored by AIST and the University of Tokyo.
"Studies on Micro Blood-Sugar Level Sensor in Microdialysis Method" research sponsored by Shizuoka University. |
| September |
Obtained ISO9002 (JQA) |
| 2000 |
| April |
"Development of Multi-Layer Mounting Board for Next-Generation Narrow-Pitch Electronic Devices," research sponsored by AIST and the University of Tokyo. |
| July |
"Introduction of Laser-advanced Special Processing"
presented at Laser Society of Japan |
| 2001 |
| April |
"Technologies on Dies and Molds for Optical Components Compatible with Multi-Wavelength Communication Using Three-Dimensional Ultraprecise Processing Technologies," research sponsored by AIST and Himeji Institute of Technology. |
| November |
"Introduction of Technologies on Precise Processing Using Laser" presented at Japan Society for Precision Engineering |
| 2002 |
| July |
"Introduction of Precise Processing Using Laser" presented at Japan Society for Precision Engineering |
| 2003 |
| April |
["Research on Casting Microminiature Electronic Devices by Metal Materials," research sponsored by AIST and Tokyo Metropolitan University |
| 2004 |
| October |
Awarded Person of Merit from Tokyo (Tamotsu Ueno, CEO) |
| 2004 |
| December |
Awarded "Nikkei Manufacturing Award" |